Continous Ultrasonic Bonding

Purpose of the seminar:

Seminars provide an overview of the latest research and development in continuous ultrasonic bonding. Attendees will learn how to apply state-of-the-art ultrasonic bonding technologies to their nonwovens and film applications. A major focus will be on maximizing bond quality and consistency with inherently variable materials. All attendees are encouraged to bring their samples and/or drawings for consultation and discussion.

Who Should Attend:

Machine operators and setters
Maintenance personnel
Production engineers
Project-related personnel
R&D personnel

Aims and content – First day
9.00 a.m. to 5.00 p.m.

Basic theory and review of the ultrasonic
bonding process
Fundamentals of continuous ultrasonic bonding process
Consistent weld forces with variable materials
Bond pattern optimization
Application case studies
Open forum- question and answer

Aims and content – Second day (optional)
9.00 a.m. to 5.00 p.m.
Second day requires participation on the first day

Assembly of ultrasonic stacks Set-up of the NON-CONTACT / NON-WEAR
bonding systems
Operation and bond process optimization
Preventative maintenance, spare parts planning
Troubleshooting issues, fault messages, replacement of components, calibration

2012 Seminars

Winston/Salem, NC — Tue., Feb 07, 2012
Atlanta, GA — Thur., Feb 09, 2012
Bartlett, IL — Thur.-Fri., Feb 23-24, 2012
Cincinnati, OH — Tue., April 10, 2012
Bartlett, IL — Thur.-Fri., May 10-11, 2012
Irvine, CA — Tue., June 12, 2012
Bartlett, IL — Thur.-Fri., Aug 23-24, 2012
Green Bay, WI — Tue., Sept 11, 2012
Minneapolis, MN — Mon., Sept 24, 2012
Bartlett, IL — Thur.-Fri., Oct 11-12, 2012
Greensboro, NC — Tue., Nov 06, 2012
Spartenburg, SC — Thur., Nov 8, 2012

For a registration form and/or further information, please send an email with your name, company, and contact information to training(at)herrmannultrasonics.co

or book directly via paypal.