About Ultrasonic Bonding - Fundamentals
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Seminar 2013

Please click on the image for a seminar brochure including registration form.
Please click on the image for a seminar brochure including registration form.

Continous Ultrasonic Bonding


Purpose of the seminar:

Seminars provide an overview of the latest research and development in continuous ultrasonic bonding. Attendees will learn how to apply state-of-the-art ultrasonic bonding technologies to their nonwovens and film applications. A major focus will be on maximizing bond quality and consistency with inherently variable materials. All attendees are encouraged to bring their samples and/or drawings for consultation and discussion.


Who Should Attend:

  • Machine operators and setters
  • Maintenance personnel
  • Production engineers
  • Project-related personnel
  • R&D personnel

 
Aims and content – First day
9.00 a.m. to 5.00 p.m.


  • Basic theory and review of the ultrasonic
    bonding process
  • Fundamentals of continuous ultrasonic bonding process
  • Consistent weld forces with variable materials
  • Bond pattern optimization
  • Application case studies
  • Open forum- question and answer




Aims and content – Second day (optional)
9.00 a.m. to 5.00 p.m.
Second day requires participation on the first day


  • Assembly of ultrasonic stacks Set-up of the NON-CONTACT / NON-WEAR
    bonding systems
  • Operation and bond process optimization
  • Preventative maintenance, spare parts planning
  • Troubleshooting issues, fault messages, replacement of components, calibration




2013 Seminars

Timetable Date Location
January - March 02/14/13 Winston/Salem, NC
  03/05/13 Atlanta, GA
  03/12/13 - 03/13/13 Bartlett, IL
April - June 04/16/13 Cincinnati, OH
  05/14/13 - 05/15/13 Bartlett, IL
  05/21/13 Mexico City, MX
July - September 07/09/13 Raleigh, NC
  08/14/13 - 08/15/13 Bartlett, IL
  10/09/13 Spartanburg, SC
October - December 10/15/13 Minneapolis, MN
  11/12/13 - 11/13/13 Bartlett, IL
11/06/13
Greensboro, NC
 
海尔曼集团  技术培训  NONWOVENS