Ultrasonic Packaging Sealing

Purpose of the seminar:

These seminars provide an overview of the principles and technical developments in ultrasonic packaging. Attendees will learn how to apply state-of-the-art sealing technologies to their packaging and filling applications. A major focus will be on maximizing operation performance and consistency, while bringing increased value to your customers. All attendees are encouraged to present their packaging challenges for consultation and discussion.

Who should attend:

Manufacturer/Packer
Equipment manufacturer
Film manufacturer
Application specialist
Design engineers
Operator

Aims and content
9.00 a.m. to 5.00 p.m.

Presentation of Herrmann Ultrasonics
Explanation of seminar aims and topics covered
Fundamentals of ultrasonics
Physical principles
Components of an ultrasonic sealing system with functions
Ultrasonic generator, operation, integration,programming and sealing process documentation
Energy focusing: Seam forms and anvil contour design
Packaging materials: Requirements and specifics Application optimization (possibilities, limits,specifics)
Discussion and questions Lab application demonstrations

2013 Seminars

Timetable	Date	Location
January - March	01/24/13	Bartlett, IL
	02/21/13	Irvine, CA
	03/19/13	Tampa, FL
April - June	04/18/13	Bartlett, IL
	05/16/13	Dallas, TX
	06/25/13	New York, NY
July - September	07/25/13	Mexcio City, MEX
	08/22/13	Bartlett, IL
	09/12/13	Atlanta, GA
October - December	10/17/13	Minneapolis, MN
	11/14/13	Cincinnati, OH
	12/12/13	Bartlett, IL