, Seminar
Ultrasonic Sealing Packaging Seminar
Location:
Herrmann Ultrasonics, Inc. North American HeadquartersHerrmann Ultrasonics, Inc
1261 Hardt Circle
Bartlett, IL 60103
USA
Language:
English (United States)
Costs:
One day seminar fee: USD 275.00 per attendee (includes manual, lunch and refreshments)
Join engineers from across the country for an immersive, day-long seminar dedicated to exploring the potential of ultrasonic technology. This session will cover essential topics, including the fundamentals of ultrasonics, sustainability, ROI, and hands-on workshops designed to deepen your understanding and test materials.
