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Herrmann worldwide

You can book us! We'll come to you at your premises or host you in one of our global Tech-Centers. Locations worldwide

Ultrasonic sealing method for packaging materials 
TECHNICAL SEMINAR

You can book us! Courses are held at Herrmann Ultrasonics, at your premises, or in one of our global Tech-Centers.

Seminar appointments by request.

Objectives and contents

  • Basic principles of ultrasonic sealing
  • Components of an ultrasonic sealing system
  • Focusing of energy: seam shapes and anvil profiles
  • Packaging materials: requirements and special features
  • Application optimization

Costs

  • One day seminar fee: $275.00 per attendee (includes manual, lunch and refreshments)

Contact and enrollment at:

+1 (630) 626-1626
info@herrmannultrasonics.com

 

After you have submitted the seminar registration, you will see a link to PayPal and you can pay online for the seminar. This ensures an easy and fast processing of your registration. If you prefer a different payment method (i.e. check or PO), please contact us.

 

Info Center Downloads

 

Seminars 2018

Date Location Language Registration
March
Thursday, 03/08/2018 Tech-Center West Coast, Irvine, CA
United States - California
English
April
Thursday, 04/19/2018 Cincinnati, OH
United States - Ohio
English
May
Thursday, 05/17/2018 New York, NY
United States - New York
English
June
Wednesday, 06/06/2018 Tech-Center West Coast, Irvine, CA
United States - California
English
Tuesday, 06/19/2018 Headquarters Bartlett, IL
United States - Illinois
English
Thursday, 06/21/2018 Minneapolis, MN
United States - Minnesota
English
October
Tuesday, 10/30/2018 Headquarters Bartlett, IL
United States - Illinois
English Register here